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Liquid immersion cooling device - メーカー・企業5社の業務用製品ランキング | イプロスものづくり

更新日： 集計期間:Apr 08, 2026～May 05, 2026
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Liquid immersion cooling deviceのメーカー・企業ランキング

更新日： 集計期間:Apr 08, 2026～May 05, 2026
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  1. TECHNICAL INFOMATION INSTITUTE CO.,LTD Tokyo//Service Industry
  2. データリソース Tokyo//others
  3. 東和電気 Tokyo//Electronic Components and Semiconductors
  4. 4 日本フォームサービス Tokyo//others
  5. 5 バーテック Osaka//Other manufacturing
企業ランキングへ

Liquid immersion cooling deviceの製品ランキング

更新日： 集計期間:Apr 08, 2026～May 05, 2026
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. [Book] AI Data Center, Heat Dissipation, Cooling of HPC (No. 2334) TECHNICAL INFOMATION INSTITUTE CO.,LTD
  2. Liquid immersion cooling - Thermal management patent series データリソース
  3. Two-phase liquid immersion cooling device "POC System" 東和電気
  4. 4 ICEraQ Micro Japan Edition 日本フォームサービス
  5. 5 What is immersion cooling that leads to cost reduction? バーテック

Liquid immersion cooling deviceの製品一覧

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ICEraQ Micro Japan Edition

ICEraQ Micro Japan Edition

An evolved version of modular data centers! Automatic control with sensor information from various locations.

The "ICEraQ Micro Japan Edition" is a self-contained immersion cooling system designed for easy installation and operation anywhere. It does not require a raised floor and blocks the noise and heat from the equipment, making it possible to set up in various locations such as offices and warehouses. Additionally, we also offer the "ICEraQ Nano." Please feel free to contact us if you have any inquiries. 【Features】 ■ 40kW heat exchange in a 24U size ■ Guard system against external shocks around the liquid tank ■ Cooling liquid pump with a 2N redundant configuration ■ 24/7 monitoring and optimal operation ■ Improved design to secure servers in racks by U ■ Enhanced maintainability *For more details, please refer to the PDF document or feel free to contact us.

  • Cooling system
  • Liquid immersion cooling device

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Two-phase liquid immersion cooling device "POC System"

Two-phase liquid immersion cooling device "POC System"

It is a tabletop-sized system that allows for simple evaluation tests in a two-phase liquid immersion cooling environment!

We would like to introduce the "POC System" handled by Towa Electric Co., Ltd. This product is a two-phase liquid immersion cooling device that immerses the entire motherboard, which has high heat-generating components such as CPUs and GPUs, in a refrigerant. It can be used as an experimental device for immersing various materials around the substrate, such as electronic components, conductive parts, and insulating materials, in boiling refrigerant for an extended period. 【Features】 ■ Easy to conduct evaluation tests in a two-phase liquid immersion cooling environment ■ Desktop size *For more details, please refer to the related links or feel free to contact us.

  • Cooling system
  • Liquid immersion cooling device

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What is immersion cooling that leads to cost reduction?

What is immersion cooling that leads to cost reduction?

It is possible to reduce the failure rate! An explanation of the benefits of implementation and points to consider when using it.

Immersion cooling is a method of directly cooling servers by immersing them in a special liquid. Compared to air cooling, it offers advantages such as reduced operational costs, making it an effective cooling method that is gaining attention in today's data-intensive environment. This document explains the mechanism and importance of immersion cooling, as well as its benefits for implementation. We encourage you to read it. 【Contents (excerpt)】 ■ What is immersion cooling? An explanation of its specific mechanism, importance, and implementation benefits - What is the mechanism of immersion cooling? - There are two types of immersion cooling - Benefits of immersion cooling - Efficient cooling is essential now that data center operating opportunities have increased *For more details, please refer to the PDF document or feel free to contact us.

  • Cooling system
  • Liquid immersion cooling device

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Liquid immersion cooling - Thermal management patent series

Liquid immersion cooling - Thermal management patent series

A technical overview of liquid immersion cooling from patent information!

This report introduces patents related to immersion cooling, which is expected to be an eco-friendly cooling method for data centers and servers. It specifically highlights 100 important patents that provide an overview of the market, serving as an optimal guide for engineers to explore the future direction they should take.

  • Cooling system
  • Liquid immersion cooling device

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[Book] AI Data Center, Heat Dissipation, Cooling of HPC (No. 2334)

[Book] AI Data Center, Heat Dissipation, Cooling of HPC (No. 2334)

[Available for trial reading] ~ TIM, immersion cooling, vapor chamber, water-cooled heat sink ~

Book Title: AI Data Centers, Heat Dissipation and Cooling Technologies for HPC －－－－－－－－－－－－－－－－－－－－－ ★ Comprehensive coverage of developments, challenges, and directions for high-frequency compatible semiconductor packaging! ★ How to achieve both dielectric performance and substrate processability －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book Application of heat dissipation materials for AI implementation and measures against rapid abnormal heat generation ■ Suppression of thermal strain using negative thermal expansion materials, measures against TIM deformation ■ Application of gap fillers to ultra-high temperature spots occurring at the semiconductor/heat sink interface ■ Achieving long-term durability and reduced thermal resistance using graphite sheets ■ Ensuring bonding reliability of power devices for data centers using Ag sintering bonding materials ■ Measurement techniques for thermal conductivity in the thickness direction, a major pathway for heat dissipation ■ Efficient prediction of the relationship between heat dissipation and electrical properties through simulation ■ Analysis of microscopic stresses inside devices and cracks at joints caused by heat damage Improving thermal transport efficiency through cooling systems and addressing excessive operation ■ Optimal design of complex cooling water flow paths and evaluation of boiling efficiency

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  • Other clean room equipment and facilities
  • Liquid immersion cooling device

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